Course Detail
Course Description
Course | Code | Semester | T+P (Hour) | Credit | ECTS |
---|
MICRO and NANOFABRICATION | BME4149580 | Fall Semester | 3+0 | 3 | 6 |
Prerequisites Courses | |
Recommended Elective Courses | |
Language of Course | English |
Course Level | First Cycle (Bachelor's Degree) |
Course Type | Elective |
Course Coordinator | Assoc.Prof. Hasan KURT |
Name of Lecturer(s) | |
Assistant(s) | |
Aim | This course introduces the theory and technology of micro/nano fabrication. Because of the interdisciplinary nature of the subject, its content includes concepts from many disciplines in engineering (electrical, materials, mechanical, chemical) and science. In this course, we will discuss the theory of basic processing techniques, such as diffusion, oxidation, photolithography, chemical vapor deposition, physical vapor deposition, etching, and metallization. |
Course Content | This course contains; ,Oxidation,Diffusion,Vacuum Systems,Chemical Vapor Diffusion,Sputtering,Evaporation,Lithography-II,Soft Lithography,Etching (wet),Etching (dry),Complementary metal-oxide-semiconductor (CMOS),Advanced Silicon Devices,Applications of Silicon Devices,Hot Topics in Micro and Nanofabrications-I,Hot topics in Micro and Nanofabrications-II. |
Dersin Öğrenme Kazanımları | Teaching Methods | Assessment Methods |
Recognizes modern CMOS manufacturing technology, process integration and production flow diagrams | 10, 12, 14, 16, 19, 21 | A |
Recognize the process modeling tools, device characterization and inspection techniques. | 12, 16, 19, 9 | A |
Compare the mask layouts, and understand the reasons for layout rules in VLSI design. | 12, 13, 19 | A |
Identify the performance metrics for each unit process | 12, 16, 19, 9 | |
Evaluates the fundamental theory and operation of equipments used in different microelectronic processes. | 12, 14, 19, 9 | A |
Recognize the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques. | 12, 14, 19, 21, 9 | A |
Teaching Methods: | 10: Discussion Method, 12: Problem Solving Method, 13: Case Study Method, 14: Self Study Method, 16: Question - Answer Technique, 19: Brainstorming Technique, 21: Simulation Technique, 9: Lecture Method |
Assessment Methods: | A: Traditional Written Exam |
Course Outline
Order | Subjects | Preliminary Work |
---|
0 | | |
1 | Oxidation | |
2 | Diffusion | |
3 | Vacuum Systems | |
4 | Chemical Vapor Diffusion | |
5 | Sputtering | |
6 | Evaporation | |
7 | Lithography-II | |
8 | Soft Lithography | |
8 | Etching (wet) | |
9 | Etching (dry) | |
10 | Complementary metal-oxide-semiconductor (CMOS) | |
11 | Advanced Silicon Devices | |
12 | Applications of Silicon Devices | |
13 | Hot Topics in Micro and Nanofabrications-I | |
14 | Hot topics in Micro and Nanofabrications-II | |
Resources |
S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press //// R. C. Jaeger, Introduction to Microelectronic Fabrication //// J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology Fundamentals, Practice and Models, Prentice Hall, 2000. |
S. M. Sze, VLSI Technology, McGraw Hill |
Course Contribution to Program Qualifications
Course Contribution to Program Qualifications |
No | Program Qualification | Contribution Level |
1 | 2 | 3 | 4 | 5 |
1 | An ability to apply knowledge of mathematics, science, and engineering | | | | | X |
2 | An ability to identify, formulate, and solve engineering problems | | | | | X |
3 | An ability to design a system, component, or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability | | | | | X |
4 | An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice | | | | X | |
5 | An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice | | | | | X |
6 | An ability to function on multidisciplinary teams | | | X | | |
7 | An ability to communicate effectively | | | | | X |
8 | A recognition of the need for, and an ability to engage in life-long learning | | | | X | |
9 | An understanding of professional and ethical responsibility | X | | | | |
10 | A knowledge of contemporary issues | | | X | | |
11 | The broad education necessary to understand the impact of engineering solutions in a global, economic, environmental, and societal context | | X | | | |
12 | Capability to apply and decide on engineering principals while understanding and rehabilitating the human body | | X | | | |
Assessment Methods
Contribution Level | Absolute Evaluation |
Rate of Midterm Exam to Success | | 30 |
Rate of Final Exam to Success | | 70 |
Total | | 100 |
ECTS / Workload Table |
Activities | Number of | Duration(Hour) | Total Workload(Hour) |
Course Hours | 14 | 3 | 42 |
Guided Problem Solving | 0 | 0 | 0 |
Resolution of Homework Problems and Submission as a Report | 10 | 4 | 40 |
Term Project | 0 | 0 | 0 |
Presentation of Project / Seminar | 0 | 0 | 0 |
Quiz | 0 | 0 | 0 |
Midterm Exam | 1 | 49 | 49 |
General Exam | 1 | 40 | 40 |
Performance Task, Maintenance Plan | 1 | 2 | 2 |
Total Workload(Hour) | 173 |
Dersin AKTS Kredisi = Toplam İş Yükü (Saat)/30*=(173/30) | 6 |
ECTS of the course: 30 hours of work is counted as 1 ECTS credit. |
Detail Informations of the Course
Course Description
Course | Code | Semester | T+P (Hour) | Credit | ECTS |
---|
MICRO and NANOFABRICATION | BME4149580 | Fall Semester | 3+0 | 3 | 6 |
Prerequisites Courses | |
Recommended Elective Courses | |
Language of Course | English |
Course Level | First Cycle (Bachelor's Degree) |
Course Type | Elective |
Course Coordinator | Assoc.Prof. Hasan KURT |
Name of Lecturer(s) | |
Assistant(s) | |
Aim | This course introduces the theory and technology of micro/nano fabrication. Because of the interdisciplinary nature of the subject, its content includes concepts from many disciplines in engineering (electrical, materials, mechanical, chemical) and science. In this course, we will discuss the theory of basic processing techniques, such as diffusion, oxidation, photolithography, chemical vapor deposition, physical vapor deposition, etching, and metallization. |
Course Content | This course contains; ,Oxidation,Diffusion,Vacuum Systems,Chemical Vapor Diffusion,Sputtering,Evaporation,Lithography-II,Soft Lithography,Etching (wet),Etching (dry),Complementary metal-oxide-semiconductor (CMOS),Advanced Silicon Devices,Applications of Silicon Devices,Hot Topics in Micro and Nanofabrications-I,Hot topics in Micro and Nanofabrications-II. |
Dersin Öğrenme Kazanımları | Teaching Methods | Assessment Methods |
Recognizes modern CMOS manufacturing technology, process integration and production flow diagrams | 10, 12, 14, 16, 19, 21 | A |
Recognize the process modeling tools, device characterization and inspection techniques. | 12, 16, 19, 9 | A |
Compare the mask layouts, and understand the reasons for layout rules in VLSI design. | 12, 13, 19 | A |
Identify the performance metrics for each unit process | 12, 16, 19, 9 | |
Evaluates the fundamental theory and operation of equipments used in different microelectronic processes. | 12, 14, 19, 9 | A |
Recognize the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques. | 12, 14, 19, 21, 9 | A |
Teaching Methods: | 10: Discussion Method, 12: Problem Solving Method, 13: Case Study Method, 14: Self Study Method, 16: Question - Answer Technique, 19: Brainstorming Technique, 21: Simulation Technique, 9: Lecture Method |
Assessment Methods: | A: Traditional Written Exam |
Course Outline
Order | Subjects | Preliminary Work |
---|
0 | | |
1 | Oxidation | |
2 | Diffusion | |
3 | Vacuum Systems | |
4 | Chemical Vapor Diffusion | |
5 | Sputtering | |
6 | Evaporation | |
7 | Lithography-II | |
8 | Soft Lithography | |
8 | Etching (wet) | |
9 | Etching (dry) | |
10 | Complementary metal-oxide-semiconductor (CMOS) | |
11 | Advanced Silicon Devices | |
12 | Applications of Silicon Devices | |
13 | Hot Topics in Micro and Nanofabrications-I | |
14 | Hot topics in Micro and Nanofabrications-II | |
Resources |
S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press //// R. C. Jaeger, Introduction to Microelectronic Fabrication //// J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology Fundamentals, Practice and Models, Prentice Hall, 2000. |
S. M. Sze, VLSI Technology, McGraw Hill |
Course Contribution to Program Qualifications
Course Contribution to Program Qualifications |
No | Program Qualification | Contribution Level |
1 | 2 | 3 | 4 | 5 |
1 | An ability to apply knowledge of mathematics, science, and engineering | | | | | X |
2 | An ability to identify, formulate, and solve engineering problems | | | | | X |
3 | An ability to design a system, component, or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability | | | | | X |
4 | An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice | | | | X | |
5 | An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice | | | | | X |
6 | An ability to function on multidisciplinary teams | | | X | | |
7 | An ability to communicate effectively | | | | | X |
8 | A recognition of the need for, and an ability to engage in life-long learning | | | | X | |
9 | An understanding of professional and ethical responsibility | X | | | | |
10 | A knowledge of contemporary issues | | | X | | |
11 | The broad education necessary to understand the impact of engineering solutions in a global, economic, environmental, and societal context | | X | | | |
12 | Capability to apply and decide on engineering principals while understanding and rehabilitating the human body | | X | | | |
Assessment Methods
Contribution Level | Absolute Evaluation |
Rate of Midterm Exam to Success | | 30 |
Rate of Final Exam to Success | | 70 |
Total | | 100 |
Numerical Data
Ekleme Tarihi: 09/10/2023 - 10:40Son Güncelleme Tarihi: 09/10/2023 - 10:41
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